Introduction for laminate technology of flexible circuits

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How to produce multi-layer flexible pcbs ? Are there any difference with rigid circuit board? Below words are simple introductions for laminate technology of flexible board.

Let's begin at laminate process of multi-layerflexible circuits: stack-up, prepare film, loading the material, closing the mould, forecast pressing, fix the shape, cooling, laying off, inspect, next process.

Note and operational instruction for stack-up:
A: Prepare liner/steel plate/silicone and clear them with adhesive paper or cloth before manufacturer.
B: Reserve the liner with right size (500m * 500m), and 400PCS steel plates are needed for every cycled stack-up so that the production will not be stopped.
C: Wear gloves or fingertip please while stack-up and no any directly contact between your hands andflexible printed circuit.
D: The stacked order should be steel plate/silicone/liner/flex PCB/liner.


Since we have mentioned laminate process and material we need, let's introduce how to place them.

Always stack-up 10 layers silicone/steel plate (except special requirement); the number ofFPCper layer subjects to the panel size (keep 7 cm or more distances between board and 4 sides of silicone); try our best to make sure FPC on the right centre of silicone and the distance of adjacent boards keep at 2cm; same FPC'S thickness per layer (for example, we can't put single board together with multi-layer board); same FPC'S pattern per layer and direction, mostly same for location and order;flexible pcboverlay or stiffener should face the top; liner ought to cover the printed circuits smoothly, no any distort and fold; lay the finished FPC down the conveyer belt to the next process. This method is widely used in shenzhenflex circuitmanufacturers.
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